
MicroMax® is a compact, high-throughput conveyorized system for non-heated applications .
MicroMax® is ideal for applications such as SMT adhesive, solder paste, conductive epoxies, solder mask, and No Flow Underfill materials.
MicroMax® has a small footprint with a width of only 36.5 inches! The work area of 12" x 12" (305 mm x 305 mm) is ideal for pc board manufacturing and boats/carriers.

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