MicroMax® II is a compact, high-throughput conveyorized system for heated applications .
MicroMax® II is ideal for heated applications such as capillary underfill, dam & fill, cavity fill, and glob top encapsulation.
MicroMax® II has a small footprint with a width of only 36.5 inches! The work area of 12" x 12" (305 mm x 305 mm) is ideal for pc board manufacturing and boats/carriers.
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